High-Density 3D Packaging Technology for CCD Micro-Camera System Module
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: IEEJ Transactions on Sensors and Micromachines
سال: 2002
ISSN: 1341-8939,1347-5525
DOI: 10.1541/ieejsmas.122.67